Eventually, Intel moved to 40-pin chips (photo: 8086). But by the 1980s, these "Dual Inline Packages" (DIPs) weren't good enough: cheap but not enough pins and much too big compared to the tiny silicon die inside. Small-outline ICs and other new packages became popular. 4/13
The 386 needed 132 pins, so Intel designed a custom ceramic pin grid array package. The ceramic package contains 6 layers of wiring: two layers for signals, two for power, and two for ground. 40 pins are used for power and ground to minimize electrical noise. 5/13