This X-ray shows the layers inside the 386 package. Thick traces go from the signal pins to the die. Power/ground have metal planes, perforated so the ceramic sticks together. Thin tungsten(?) wires to the package edge are used to electroplate the pins. 7/13
This closeup shows how tiny bond wires connect the die to the package. The package has two tiers of golden pads that are connected to the tiny bond pads on the silicon die. 8/13