Packaging is underappreciated, but it is essential to making chips small and reliable. In particular, getting power to a chip and then distributing power on the chip is harder than you might think. Nowadays, packaging, power, and removing heat is an even bigger issue. 11/13
Credits and links:
Thanks to https://twitter.com/johndmcmaster for taking the X-rays.
Package cross section from "High Performance Technology, Circuits and Packaging for the 80386", ICCD 1986.
16-pin quotes from Federico Faggin http://archive.computerhistory.org/resources/text/Oral_History/Faggin_Federico/Faggin_Federico_1_2_3.oral_history.2004.102658025.pdf
4004 photo by Thomas Nguyen (CC BY-SA 4.0 DEED) https://commons.wikimedia.org/wiki/File:Intel_C4004_b.jpg
386SX photo by FDominec https://commons.wikimedia.org/wiki/File:Intel386sx_a_50_Kc.jpg 12/13
Credits and links:
Thanks to https://twitter.com/johndmcmaster for taking the X-rays.
Package cross section from "High Performance Technology, Circuits and Packaging for the 80386", ICCD 1986.
16-pin quotes from Federico Faggin http://archive.computerhistory.org/resources/text/Oral_History/Faggin_Federico/Faggin_Federico_1_2_3.oral_history.2004.102658025.pdf
4004 photo by Thomas Nguyen (CC BY-SA 4.0 DEED) https://commons.wikimedia.org/wiki/File:Intel_C4004_b.jpg
386SX photo by FDominec https://...