@gsuberland AFAIK there was a materials problem with...

@gsuberland AFAIK there was a materials problem with solder joint reliability that caused Red Ring of Death. Or, if it was a capacitor problem, the caps were on the BGA itself and not on the motherboard.

This is based what people were oddly quiet about, and who was quiet.

Like 5 September at 11:58 | Wall-to-wall | Open on mstdn.social

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9names

@trollball @gsuberland https://youtu.be/z2d6IMBS8oY?t=1148
this is publicly confirmed as the root cause for the high rate of RROD in early xbox360's

5 September at 13:12 | Open on hachyderm.io

Marc Jacobs

@9names @gsuberland They skim over that it was a temp cycle failure between the die and the BGA substrate, on a FCBGA. Not between the BGA substrate and the PCB.

The video makes it sound like temp cycling is an odd thing to cause failures.

5 September at 13:27 | Open on mstdn.social

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