@trollball @gsuberland https://youtu.be/z2d6IMBS8oY?t=1148 this is publicly confirmed as the root cause for the high rate of RROD in early xbox360's
@9names @gsuberland They skim over that it was a temp cycle failure between the die and the BGA substrate, on a FCBGA. Not between the BGA substrate and the PCB.
The video makes it sound like temp cycling is an odd thing to cause failures.
@9names @gsuberland They skim over that it was a temp cycle failure between the die and the BGA substrate, on a FCBGA. Not between the BGA substrate and the PCB.
The video makes it sound like temp cycling is an odd thing to cause failures.