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9names

@trollball @gsuberland youtu.be/z2d6IMBS8oY?t=1148
this is publicly confirmed as the root cause for the high rate of RROD in early xbox360's

1 comment
Marc Jacobs

@9names @gsuberland They skim over that it was a temp cycle failure between the die and the BGA substrate, on a FCBGA. Not between the BGA substrate and the PCB.

The video makes it sound like temp cycling is an odd thing to cause failures.

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