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Tube❄️Time

this card is fascinating to me because the layout is unusual but very much the way certain divisions at IBM liked to do things. all the pads and vias are on a strict 0.1" grid. the traces are quite thin: only 5 mils! there are no traces on the top and bottom of the board: everything you see here is on layer 2.

7 comments
Manawyrm | Sarah

@tubetime this looks like a prime candidate for xray imaging :)

Tube❄️Time

it's tough to reverse engineer this visually because traces can run underneath the pads! as long as they don't touch the plated via barrel, they're not connected. I'm glad I've got the netlist.

Tube❄️Time

I've already created a schematic from that netlist. it helps understand how the card works. it pretty much just buffers the address and data lines to the cable, although it also has a state machine for adding wait states to slow down the ISA bus.

Trammell Hudson

@tubetime the CM-2 had a similar clear soldermask, the nearly transparent laminate layers, and an almost uniform grid of through-holes (although there are some exceptions, and there are traces on all layers)

entire Connections Machines compute node underside of the board with lots of through holes
close up of the underside with some traces visible on the bottom layer, as well as all of the other layers
Tube❄️Time

@th wild, I really wonder what design software they used

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