Gregory's Serverstill a few footprints to go, but it's easier to place vias now, and traces.
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21 comments
  ahh that makes more sense. there are a few higher current connections, but more importantly, there are cuts in the ground plane! this creates a star ground at the large highlighted pad near the middle. this is the negative battery terminal (but after the current sense resistor) anyway, i could fix up a few footprints but this reverse engineering job is essentially completed. you can find the design files here: https://github.com/schlae/Thinkpad700CPower @tubetime Amazing job, would love to see a video on how exactly you go about it.  @tubetime That's amazing. What's the quote? Ah, yes. "Sometimes, magic is just someone spending more time on something than anyone else might reasonably expect." -- Teller @gogobonobo the thread explains how i did it. higher layer count boards require more invasive methods. but yes i wanted to be able to debug boards corroded by a leaking capacitor. @tubetime How did you get to these middle layers? I mean, you can measure some connections, but not get the layout exactly, unless you open it or have some 3d x-rays or something. @tubetime does kicad have any way to see multiple layers side by side? Sometimes when I have components on both sides that overlap it gets difficult even when I’m changing layer visibility. @tubetime Ohming it out on that scale is impressive. I just did the same on a board with just 20 dip ics and even that was a long task. Well, I guess it didn't help that the ohming was done remotely by a friend who was a few hundred miles away and had borrowed the card to clone while i was doing the KiCad part :) |
down to the last few traces. i'm using a multimeter to ohm out and discover what they are connected to.
you can also see the faint outline of traces on layer 2 (the board has four layers). i'll need to route those next.