The final hurdle is probably the label... I've taken...

The final hurdle is probably the label... I've taken apart some modules where the label is not an issue, and others (like this one - oopsy), where the label interferes and gets scuffed.

A screwdriver can be inserted under the EMI fingers to just lift the sheath slightly away from the label.

A closeup photo of the label, with some damage. The top clear lamination is coming away in both front corners, and one corner is damaged a little deeper, affecting the print.

A phot of the module, with a screwdriver posed to lift the sheath.

Like 3 July at 23:09 | Open on chaos.social

7 comments

Attie Grande

We're in!

The retention mechanism (handle & clip) will almost certainly fall on the table, so make sure you rescue them.

There may also be a plastic shim to keep the ROSA / TOSA securely in place, but not all modules have this.

Finally, a single screw will usually allow the PCB to lift away from the chassis. There are sometimes metal features on the chassis to "hold" the PCB at the far end from the screw, but not always - just be gentle and it'll come out.

Watch out for a thermal interface!

A closeup photo of the PCB, with a phillips screw visible. In the background (and very out of focus) is the head of a phillips screwdriver.

3 July at 23:13 | Open on chaos.social

Attie Grande

Finally, here are all the bits.

No thermal interface in this module, which was a little unexpected. If I remember correctly, the GPON modules I've opened had it... 80km is definately further, but perhaps 100Mbit/s is the key factor here for power dissipation.